MAGNION Series Magnetron Sputtering Sources
Plasmionique’s MAGNION Series of sputtering magnetrons are designed for sputtering circular planar targets. Custom designs for special applications are also possible.
General specifications are as follows:
Technical Note: Magnetic Configuration of Sputtering Magnetron Sources
There are three categories of sputtering magnetrons, distinguished by the geometry of the magnetic field lines:
- Unbalanced Type I
- Unbalanced Type II
The magnetic geometry of the magnetron influences the deposition process. Balanced magnetrons, to a large extent, confine the plasma to near the cathode surface. This makes them useful as a general-purpose sputtering source. They are most suitable for deposition on polymers and substrates which must be maintained at low deposition temperature. Unbalanced magnetrons have some open field lines which allow electrons to escape from the plasma confinement zone (plasma expansion). The interaction of the expanding plasma with the substrate influences the coating characteristics.
The magnetic field configuration also influences the target utilisation efficiency. The design for our unbalanced magnetron cathodes yields high target utilisation. For example, for a small two-inch cathode (unbalanced Type II), target utilisation rate in excess of 50% has been achieved. Larger diameter targets offer much higher utilisation efficiency.
Further reading: B. Window & N. Savvides, J. Vac. Sci. Technol. A 4 (1986) 196