PVD TURN-KEY SYSTEMS
Plasmionique's PVD systems are highly versatile semi-automated or fully automated customized systems integrating a variety of Physical Vapour Deposition technologies. All systems are controlled by our PLASMICON proprietary control system.
The MAGNION Series of sputter deposition systems are turn-key units customized to fit the end users' requirements. They are highly versatile with fully integrated control and data acquisition systems.
Plasmionique’s proprietary MAGNION Series sputtering cathodes are designed for high target utilization efficiency, and are available in balanced and unbalanced magnetic configurations in circular or rectangular shapes. The magnetron cathodes are able to operate in DC, pulse-DC, AC or RF biasing modes.
Optionally, these systems can include a PLUME series remote plasma source for Enhanced Reactive Sputter Deposition. Substrate rotation, heating, biasing, and computer controlled axial motions are options available on all systems.
The MAGNION Series Systems are also offered as :
Hybrid Deposition Systems
MAGNION Series
MAGNETRON OR ION-BEAM SPUTTER DEPOSITION SYSTEMS
Typical Sputtering System Characteristics
MAGNION Sputtering Magnetrons
Substrate/Sample Mount
Process Environment
Substrate/ Sample Mount
Magnetrons/Plasma Sources
Utility Requirements
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Target sizes circular 1”, 2”, 3”, 4” diameter, or rectangular
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Operation with RF(13.56 MHz) DC or Pulsed-DC
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Balanced or unbalanced magnetic geometries
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Cross-contamination shields and shutters
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Option for adjustable axial position or head angle
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User defined mount size/shape
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Heating to over 850 ºC with PID temperature control or cooling
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Motorized sample rotation and axial translation
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Biasing (RF or DC) available
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Load-lock sample transfer station (optional)
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Stainless steel chamber, vertical or horizontal cylindrical
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Access door or split chamber design
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Vacuum to 10-8 Torr range with turbomolecular pump backed with rotary vane or dry scroll mechanical pump
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Operation with oxygen or corrosive gases (optional)
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Vacuum gauges: wide-range gauge and capacitance manometer for process pressure control
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FLOCON Series Gas management system for multiple gases or vapors, with mass flow controllers, fully automatic and programmable to tailor the gas mix
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User defined number of Mass Flow Controllers with shut-off valves
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Purge/vent line with safety pressure relief valve
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User defined sample size/shape
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Heating to over 850 ºC with PID temperature control or cooling
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Motorized rotation and axial translation motorized or manual
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Biasing (RF or DC) available
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Load-lock sample transfer station (optional)
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Target sizes circular 1”, 2”, 3”, 4” diameter, or rectangular
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Operation with RF(13.56 MHz) DC or Pulse-DC
-
Balanced or unbalanced magnetic geometries
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Cross-contamination shields and shutters
-
Option for adjustable axial position or head angle
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Electrical: typically 60/50Hz, 120 single-phase to 380V 3-phase, 5-wire
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Cooling water: typically 1-4 gpm, 17-30 ºC, system dependent
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Instrument air: 40-80 psig (3-5 bar)
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Purge/vent gas, regulated
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Process gases, regulated