PLASMA ETCHING SYSTEMS
Plasmionique offers various plasma reactors for cleaning, etching, Plasma-Enhanced Chemical Vapour Deposition (PECVD) and synthesis of nanostructured materials. Processes are carried out using DC, HF, RF or microwave generated plasma, in atmospheric or low pressure regimes.
The difference between plasma etching and PECVD, in principle, is only the plasma chemistry. In the etching process the chemical reaction with a substrate results in volatile molecules that are pumped away, whereas in PECVD the reactions between plasma radicals leave a solid by-product on the surfaces that they come into contact with.