MAGNION Series Magnetron Sputter Deposition Systems


MAGNION Series Sputter Deposition Systems

Brochure (PDF) MAGNION Series

In magnetron sputtering, a  DC or RF plasma is produced with the target as the cathode.  A magnetic field is used to produce a region of enhanced ionisation near the target. Ions from the plasma strike the target and cause neutral particles to be ejected at a relatively high rate, and travel to and deposited on the substrate or work-piece.

Plasmionique’s proprietary MAGNION Series magnetron sputtering sources are integrated into flexible, versatile thin-film deposition systems with features including:


Magnetron sputtering sources :

  • Planar targets, circular 1-inch, 2-inch, 3-inch, 4-inch diameter, or rectangular
  • Power: RF, DC, or pulsed DC
  • Balanced or unbalanced magnetic geometries available to suit the application
  • Cross-contamination shields and shutters standard in multi-gun systems


Substrate Mounting and Manipulation :

  • Substrate heating or cooling available with PID temperature control
  • Biasing (DC or RF) available if required
  • Sample motion / manipulation for optimised film uniformity
    • Axial translation, manual or computer-controlled
    • Rotation, computer-controlled 0-20 rpm
  • Load-lock sample transfer station available


Process environment:

  • Turbomolecular pumping system (cryopumping also available if required)
  • Gas management panel for multiple gases with mass flow controllers (MFCs), fully automatic and programmable to tailor the gas mix
  • Capacitance manometer for measuring process pressure
  • Automatic pressure control: downstream using throttling gate valve or upstream using the MFCs


Process control system:

  • LabVIEW® based control system for monitoring and controlling all system variables
  • Intuitive graphic user interface
  • Alarms and interlocks to protect system hardware and warn of unsafe conditions
  • Real-time plotting and data logging
  • Multi-step programming for complicated process “recipes”