Etching & Cleaning Reactors
Plasma reactors designed for etching and cleaning are similar to PECVD reactors, in construction, although some operation parameters, such as substrate temperature, process gases used, are different.
Plasma reactors used for etching could be configured as Plasma Etching (PE), Reactive Ion Etching (RIE) and Deep Reactive Ion Etching (DRIE).
Options for Ion Beam Etching (IBE) is also available.
Plasmionique systems for etching and cleaning are summarized below:
|Application||Reactor Type||Configuration||View brochure|
||FLARION Series Plasma Reactors and Sources (PDF)|
||PLUME Series ICP Plasma and Ion Sources (PDF)|
||see links above|
*DRIE: Deep Reactive Ion Etching