• LabView®-based monitoring and control software

• Intuitive graphical user interface

• Multi-step programming for process recipes

• Plotting and data-logging

• Program mode for programming multi-step processes

• Alarms and interlocks to protect system hardware and warn of unsafe conditions

• Real-time plotting and data logging

• Remote support interface

• Options for Optical Emission and Mass spectroscopy Diagnostic interfaced to process control Plasma Source Option

• Optional Remote ICP source for enhance reactive sputter deposition

• Independent power supply and integrated control included​

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• Stainless steel chamber, vertical or horizontal cylindrical 

• Access door or split chamber design

• Vacuum to 10-8 Torr range with turbomolecular pump backed with rotary vane or dry scroll mechanical pump

• Operation with oxygen or corrosive gases (optional)

• Vacuum gauges: wide-range gauge and capacitance manometer for process pressure control

• FLOCON Series Gas management system for multiple gases or vapors, with mass flow controllers, fully automatic and programmable to tailor the gas mix 

• User defined number of Mass Flow Controllers with shut-off valves

• Purge/vent line with safety pressure relief valve

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• User defined sample size/shape

• Heating to over 850 ºC with PID temperature control or cooling

• Motorized rotation and axial translation motorized or manual 

• Biasing (RF or DC) available

• Load-lock sample transfer station (optional)

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• Target sizes circular 1”, 2”, 3”, 4” diameter, or rectangular

• Operation with RF(13.56 MHz) DC or Pulse-DC

• Balanced or unbalanced magnetic geometries

• Cross-contamination shields and shutters

• Option for adjustable axial position or head angle

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• Electrical: typically 60/50Hz, 120 single-phase to 380V 3-phase, 5-wire

• Cooling water: typically 1-4 gpm, 17-30 ºC, system dependent

• Instrument air: 40-80 psig (3-5 bar)

• Purge/vent gas, regulated

• Process gases, regulated