 |
 |
 |
 |
 |
 |
 |
|
|||||||||
|
|
||||||||
|
|||||||||
|
|||||||||
| | Plasma Sources | Deposition systems | Components | SPUTTERING SYSTEMS | ||||
| Choosing Your Magnetron | ||||
| MAGNION-B A Balanced Magnetron sputtering Source MAGNION-UI An Unbalanced Magnetron sputtering source of Type 1 MAGNION-UII An Unbalanced Magnetron sputtering source of Type 2 MAGNION cathode design eliminates exposure of magnets to water. Typical Magnetic field configurations for various types of Magnetron Cathodes
|
Plasmionique offers 3 generic categories of Planar Magnetron Sputtering Cathodes: |
|||
 |
||||
| MAGNION SERIES PVD Systems | ||||
|
||||
| Magnetron Design with High Target Utilization | ||||
|
The Magnetic Field Configuration also influences the target utilization efficiency.
Thedesign for our Unbalanced Magnetron Cathodes yields high target utilization. For example, for a small 2"cathode (unbalanced Type 2) target utilization rate in excess of
50% is achieved. Larger diameter targets offer much higher utilization efficiency. |
  An example of the target utilization profile for a 2 inch Copper Target, 1/4 inches thick used with magnetron designed for High Target Utilization |
|||
